| 1주차 |
Lecture 1 Course overview |
| 2주차 |
Lecture 2 Electrical Engineering |
| 3주차 |
Lecture 3 Industry & Devices |
| 4주차 |
Lecture 4 Patterning & Miniaturization |
| 5주차 |
Lecture 5 Thin Film & CMP |
| 6주차 |
Lecture 6 Plasma |
| 7주차 |
Lecture 7 Process Integration & Diffusion |
| 8주차 |
Midterm Exam |
| 9주차 |
Lecture 8 Trend of Packaging Technology |
| 10주차 |
Lecture 9 Types of Chip Packages |
| 11주차 |
Lecture 10 Wafer Level Packaging |
| 12주차 |
Lecture 11 3D-IC Packaging |
| 13주차 |
Lecture 12 System-in-Package |
| 14주차 |
Lecture 13 Bumping & Manufacturing |
| 15주차 |
Lecture 14 Reliability & Industrial Engineering |
| 16주차 |
|