1주차 |
Lecture 1 Course overview |
2주차 |
Lecture 2 Electrical Engineering |
3주차 |
Lecture 3 Industry & Devices |
4주차 |
Lecture 4 Patterning & Miniaturization |
5주차 |
Lecture 5 Thin Film & CMP |
6주차 |
Lecture 6 Plasma |
7주차 |
Lecture 7 Process Integration & Diffusion |
8주차 |
Midterm Exam |
9주차 |
5/11 Lecture 8 Trend of Packaging Technology |
10주차 |
5/18 Lecture 9 Types of Chip Packages |
11주차 |
5/25 Lecture 10 Wafer Level Packaging |
12주차 |
5/25 Lecture 11 3D-IC Packaging (보강) |
13주차 |
6/01 Lecture 12 System-in-Package |
14주차 |
6/08 Lecture 13 Bumping & Manufacturing |
15주차 |
6/15 Lecture 14 Reliability & Industrial Engineering |
16주차 |
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